Kompakter Verbinder mit geringer Bauhöhe
Wide-ranging requirements, but too few solutions in small modular sizes? This changes with the SMT Series 5265 from W+P.
It offers a wire-to-board connection in crimp friction- lock technology suitable for both classic W-t-B applications and LED areas.
Consisting of a horizontal pin header, female housings with matching contacts, the two-pole components ensure reliable contacting and precise connection; thanks to the small modular dimension of 1.80mm and the low components height of 0.9mm, the series is ideally compact in terms of space.
The system covers wire cross-sections from AWG 34 – 28. A current ampacity up to 2 A is given, specifically: (1.3 A AC/DC – AWG 34, 1.5 A – AWG 32, 1.8 A – AWG 30, 2.0 A – AWG 28).
The contact material consists of a copper alloy and the insulator is made of thermoplastic per UL94 V-0. The series 5265 is designed for contact resistance < 20 mΩ, a reliable functionality is guaranteed in a temperature range from -25°C to +85°C. Processing is by reflow soldering.
This surface mountable series also meets the conventional design requirements of miniaturisation. In addition to the industrial sector, applications such as sensors and power supplies in the embedded sector, industrial electronics, measurement and regulation technology, control technology - LED applications are also covered.
Data sheets and representative samples may be requested free of charge.